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材料特點(diǎn)：

1.高速無(wú)鹵中Tg中損耗環(huán)保材料

2.材料Tg≥155。C(DSC), Df≤0.009

3.良好的加工性和抗CAF可靠性

4.高階HDI應(yīng)用

Material Characteristics

1.High speed halogen free, Middle Tg, Mid loss

2.Material TG≥155。C (DSC), DF≤0.009

3.Excellent machinability and anti CAF reliability

4.High order HDI applications

產(chǎn)品應(yīng)用：

智能手機(jī)、平板電腦、筆記本電腦、消費(fèi)性電子等

對(duì)等材料:IX-X68G

Product Application

Smart phones, tablets, laptops, consumer

electronics, etc

Equivalent material: |X-X68G