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材料特點(diǎn)：

1.無鉛高Tg材料  

2.材料Tg≥170。C(DSC),Td≥345。C  

3.與FR-4制造工藝兼容  

4.低Z-CTE及高耐熱信賴性,良好的抗CAF能力 

Material Characteristics

1.Lead free high Tg material

2.MaterialTG≥170。C (DSC),TD≥345 °C

3.Compatible with FR-4 manufacturing process

4.Low Z-CTE and high heat-resistant reliability,excellent CAF resistance

產(chǎn)品應(yīng)用：

汽車板、多層板、HDI產(chǎn)品、背板、數(shù)據(jù)儲(chǔ)存、服務(wù)器、網(wǎng)絡(luò)通訊、厚銅板  

對(duì)等材料:IX-X8XX\XM827\370HX  

Product Application

Automobile board, multilayer board, HDI product,backplane, data storage, server, network communication,thick copper plate

Equivalent material:IX-X8XX)XM827\370HX